Panel discussion: Current threats, future opportunities?
The morning panel discussion is usually one of the highlights of the OBALKO congress program. It won’t be any different in October, either. This year’s panel will follow up on the opening block of presentations, with the panelists focusing more on current and future threats to the Czech and Slovak packaging market. They will discuss not only the problems but also the possible ways out and solutions. And this from the point of view of human resources, energy consumption, purchase of input raw materials, consolidation of supply chains and the expected development in the national and European economies with related impacts on the purchasing power of the population. The panel will feature representatives of packaging solution suppliers as well as representatives of major manufacturing companies that package large quantities of goods and are therefore affected by potential threats to the packaging market as a whole.