About the event

Launched in 2013, the OBALKO packaging congress is the largest gathering of packaging professionals in the Czech Republic and Slovakia. The goal of the congress is to provide a platform for discussing the key issues affecting the packaging market while inspiring packaging professionals on how to improve their packaging and packaging processes and giving ample opportunity to make new business contacts. You can learn more about the various program parts by clicking the links to the right.

The 11th OBALKO congress which took place on 19-20 October 2023 in Prague, was the most successful edition to date. A total of 491 participants attended the congress, which was a record number. 41 trophies for the best packaging were presented, 34 speakers including three keynote speakers spoke at 17 programme points, 12 case studies were presented, two panel discussions were debated and four plant visits were on offer. The event was supported by 45 partners and 21 media outlets. There were 94 meetings held as part of the speed-dating platform.